一、綜合詞匯

1、印制電路：printed circuit

2、印制線路：printed wiring

3、印制板：printed board

4、印制板電路：printed circuit board(PCB)

5、印制線路板：printed wiring board(PWB)

6、印制組件：printed component

7、印制接點：printed contact

8、印制板裝配：printed board assembly

9、板：board

10、單面印制板：single-sided printed board(SSB)

11、雙面印制板：double-sided printed board(DSB)

12、多層印制板：mulitlayer printed board(MLB)

13、多層印制電路板：mulitlayer printed circuit board

14、多層印制線路板：mulitlayer prited wiring board

15、剛性印制板：rigid printed board

16、剛性單面印制板：rigid single-sided printed borad

17、剛性雙面印制板：rigid double-sided printed borad

18、剛性多層印制板：rigid multilayer printed board

19、撓性多層印制板：flexible multilayer printed board

20、撓性印制板：flexible printed board

21、撓性單面印制板：flexible single-sided printed board

22、撓性雙面印制板：flexible double-sided printed board

23、撓性印制電路：flexible printed circuit(FPC)

24、撓性印制線路：flexible printed wiring

25、剛性印制板：flex-rigid printed board,rigid-flex printed board

26、剛性雙面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed

27、剛性多層印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board

28、齊平印制板：flush printed board

29、金屬芯印制板：metal core printed board

30、金屬基印制板：metal base printed board

31、多重布線印制板：mulit-wiring printed board

32、陶瓷印制板：ceramic substrate printed board

33、導電膠印制板：electroconductive paste printed board

34、模塑電路板：molded circuit board

35、模壓印制板：stamped printed wiring board

36、順序?qū)訅憾鄬佑≈瓢澹簊equentially-laminated mulitlayer

37、散線印制板：discrete wiring board

38、微線印制板：micro wire board

39、積層印制板：buile-up printed board

40、積層多層印制板：build-up mulitlayer printed board(BUM)

41、積層撓印制板：build-up flexible printed board

42、表面層合電路板：surface laminar circuit(SLC)

43、埋入凸塊連印制板：B2it printed board

44、多層膜基板：multi-layered film substrate(MFS)

45、層間全內(nèi)導通多層印制板：ALIVH multilayer printed board

46、載芯片板：chip on board(COB)

47、埋電阻板：buried resistance board

48、母板：mother board

49、子板：daughter board

50、背板：backplane

51、裸板：bare board

52、鍵盤板夾心板：copper-invar-copper board

53、動態(tài)撓性板：dynamic flex board

54、靜態(tài)撓性板：static flex board

55、可斷拼板：break-away planel

56、電纜：cable

57、撓性扁平電纜：flexible flat cable(FFC)

58、薄膜開關(guān)：membrane switch

59、混合電路：hybrid circuit

60、厚膜：thick film

61、厚膜電路：thick film circuit

62、薄膜：thin film

63、薄膜混合電路：thin film hybrid circuit

64、互連：interconnection

65、導線：conductor trace line

66、齊平導線：flush conductor

67、傳輸線：transmission line

68、跨交：crossover

69、板邊插頭：edge-board contact

70、增強板：stiffener

71、基底：substrate

72、基板面：real estate

73、導線面：conductor side

74、組件面：component side

75、焊接面：solder side

76、印制：printing

77、網(wǎng)格：grid

78、圖形：pattern

79、導電圖形：conductive pattern

80、非導電圖形：non-conductive pattern

81、字符：legend

82、標志：mark

二、基材：

1、基材：base material

2、層壓板：laminate

3、覆金屬箔基材：metal-clad bade material

4、覆銅箔層壓板：copper-clad laminate(CCL)

5、單面覆銅箔層壓板：single-sided copper-clad laminate

6、雙面覆銅箔層壓板：double-sided copper-clad laminate

7、復合層壓板：composite laminate

8、薄層壓板：thin laminate

9、金屬芯覆銅箔層壓板：metal core copper-clad laminate

10、金屬基覆銅層壓板：metal base copper-clad laminate

11、撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film

12、基體材料：basis material

13、預浸材料：prepreg

14、粘結(jié)片：bonding sheet

15、預浸粘結(jié)片：preimpregnated bonding sheer

16、環(huán)氧玻璃基板：epoxy glass substrate

17、加成法用層壓板：laminate for additive process

18、預制內(nèi)層覆箔板：mass lamination panel

19、內(nèi)層芯板：core material

20、催化板材：catalyzed board,coated catalyzed laminate

21、涂膠催化層壓板：adhesive-coated catalyzed laminate

22、涂膠無催層壓板：adhesive-coated uncatalyzed laminate

23、粘結(jié)層：bonding layer

24、粘結(jié)膜：film adhesive

25、涂膠粘劑絕緣薄膜：adhesive coated dielectric film

26、無支撐膠粘劑膜：unsupported adhesive film

27、覆蓋層：cover layer(cover lay)

28、增強板材：stiffener material

29、銅箔面：copper-clad surface

30、去銅箔面：foil removal surface

31、層壓板面：unclad laminate surface

32、基膜面：base film surface

33、膠粘劑面：adhesive faec

34、原始光潔面：plate finish

35、粗面：matt finish

36、縱向：length wise direction

37、模向：cross wise direction

38、剪切板：cut to size panel

39、酚醛紙質(zhì)覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)

40、環(huán)氧紙質(zhì)覆銅箔板：epoxide cellulose paper copper-clad laminates(epoxy/paper CCL)

41、環(huán)氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates

42、環(huán)氧玻璃布紙復合覆銅箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates

43、環(huán)氧玻璃布玻璃纖維復合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates

44、聚酯玻璃布覆銅箔板：ployester woven glass fabric copper-clad laminates

45、聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates

46、雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates

47、環(huán)氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates

48、聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates

49、超薄型層壓板：ultra thin laminate

50、陶瓷基覆銅箔板：ceramics base copper-clad laminates

51、紫外線阻擋型覆銅箔板：UV blocking copper-clad laminates

三、基材的材料

1、A階樹脂：A-stage resin

2、B階樹脂：B-stage resin

3、C階樹脂：C-stage resin

4、環(huán)氧樹脂：epoxy resin

5、酚醛樹脂：phenolic resin

6、聚酯樹脂：polyester resin

7、聚酰亞胺樹脂：polyimide resin

8、雙馬來酰亞胺三嗪樹脂：bismaleimide-triazine resin

9、丙烯酸樹脂：acrylic resin

10、三聚氰胺甲醛樹脂：melamine formaldehyde resin

11、多官能環(huán)氧樹脂：polyfunctional epoxy resin

12、溴化環(huán)氧樹脂：brominated epoxy resin

13、環(huán)氧酚醛：epoxy novolac

14、氟樹脂：fluroresin

15、硅樹脂：silicone resin

16、硅烷：silane

17、聚合物：polymer

18、無定形聚合物：amorphous polymer

19、結(jié)晶現(xiàn)象：crystalline polamer

20、雙晶現(xiàn)象：dimorphism

21、共聚物：copolymer

22、合成樹脂：synthetic

23、熱固性樹脂：thermosetting resin

24、熱塑性樹脂：thermoplastic resin

25、感旋光性樹脂：photosensitive resin

26、環(huán)氧當量：weight per epoxy equivalent(WPE)

27、環(huán)氧值：epoxy value

28、雙氰胺：dicyandiamide

29、粘結(jié)劑：binder

30、膠粘劑：adesive

31、固化劑：curing agent

32、阻燃劑：flame retardant

33、遮光劑：opaquer

34、增塑劑：plasticizers

35、不飽和聚酯：unsatuiated polyester

36、聚酯薄膜：polyester

37、聚酰亞胺薄膜：polyimide film(PI)

38、聚四氟乙烯：polytetrafluoetylene(PTFE)

39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(FEP)

40、增強材料：reinforcing material

41、玻璃纖維：glass fiber

42、E玻璃纖維：E-glass fibre

43、D玻璃纖維：D-glass fibre

44、S玻璃纖維：S-glass fibre

45、玻璃布：glass fabric

46、非織布：non-woven fabric

47、玻璃纖維墊：glass mats

48、紗線：yarn

49、單絲：filament

50、絞股：strand

51、緯紗：weft yarn

52、經(jīng)紗：warp yarn

53、但尼爾：denier

54、經(jīng)向：warp-wise

55、緯向：weft-wise,filling-wise

56、織物經(jīng)緯密度：thread count

57、織物組織：weave structure

58、平紋組織：plain structure

59、壞布：grey fabric

60、稀松織物：woven scrim

61、弓緯：bow of weave

62、斷經(jīng)：end missing

63、缺緯：mis-picks

64、緯斜：bias

65、折痕：crease

66、云織：waviness

67、魚眼：fish eye

68、毛圈長：feather length

69、厚薄段：mark

70、裂縫：split

71、捻度：twist of yarn

72、浸潤劑含量：size content

73、浸潤劑殘留量：size residue

74、處理劑含量：finish level

75、浸潤劑：size

76、偶聯(lián)劑：couplint agent

77、處理織物：finished fabric

78、聚酰胺纖維：polyarmide fiber

79、聚酯纖維非織布：non-woven polyester fabric

80、浸漬絕緣縱紙：impregnating insulation paper

81、聚芳酰胺纖維紙：aromatic polyamide paper

82、斷裂長：breaking length

83、吸水高度：height of capillary rise

84、濕強度保留率：wet strength retention

85、白度：whitenness

86、陶瓷：ceramics

87、導電箔：conductive foil

88、銅箔：copper foil

89、電解銅箔：electrodeposited copper foil(ED copper foil)

90、壓延銅箔：rolled copper foil

91、退火銅箔：annealed copper foil

92、壓延退火銅箔：rolled annealed copper foil(RA copper foil)

93、薄銅箔：thin copper foil

94、涂膠銅箔：adhesive coated foil

95、涂膠脂銅箔：resin coated copper foil(RCC)

96、復合金屬箔：composite metallic material

97、載體箔：carrier foil

98、殷瓦：invar

99、箔（剖面）輪廓：foil profile

100、光面：shiny side

101、粗糙面：matte side

102、處理面：treated side

103、防銹處理：stain proofing

104、雙面處理銅箔：double treated foil

四、設計

1、原理圖：shematic diagram

2、邏輯圖：logic diagram

3、印制線路布設：printed wire layout

4、布設總圖：master drawing

5、可制造性設計：design-for-manufacturability

6、計算機輔助設計：computer-aided design.(CAD)

7、計算機輔助制造：computer-aided manufacturing.(CAM)

8、計算機集成制造：computer integrat manufacturing.(CIM)

9、計算機輔助工程：computer-aided engineering.(CAE)

10、計算機輔助測試：computer-aided test.(CAT)

11、電子設計自動化：electric design automation.(EDA)

12、工程設計自動化：engineering design automaton.(EDA2)

13、組裝設計自動化：assembly aided architectural design.(AAAD)

14、計算機輔助制圖：computer aided drawing

15、計算機控制顯示：computer controlled display.(CCD)

16、布局：placement

17、布線：routing

18、布圖設計：layout

19、重布：rerouting

20、模擬：simulation

21、邏輯模擬：logic simulation

22、電路模擬：circit simulation

23、時序模擬：timing simulation

24、模塊化：modularization

25、布線完成率：layout effeciency

26、機器描述格式：machine descriptionm format.(MDF)

27、機器描述格式數(shù)據(jù)庫：MDF databse

28、設計數(shù)據(jù)庫：design database

29、設計原點：design origin

30、優(yōu)化（設計）：optimization(design)

31、供設計優(yōu)化坐標軸：predominant axis

32、表格原點：table origin

33、鏡像：mirroring

34、驅(qū)動文件：drive file

35、中間文件：intermediate file

36、制造文件：manufacturing documentation

37、隊列支撐數(shù)據(jù)庫：queue support database

38、組件安置：component positioning

39、圖形顯示：graphics dispaly

40、比例因子：scaling factor

41、掃描填充：scan filling

42、矩形填充：rectangle filling

43、填充域：region filling

44、實體設計：physical design

45、邏輯設計：logic design

46、邏輯電路：logic circuit

47、層次設計：hierarchical design

48、自頂向下設計：top-down design

49、自底向上設計：bottom-up design

50、線網(wǎng)：net

51、數(shù)字化：digitzing

52、設計規(guī)則檢查：design rule checking

53、走（布）線器：router(CAD)

54、網(wǎng)絡表：net list

55、計算機輔助電路分析：computer-aided circuit analysis

56、子線網(wǎng)：subnet

57、目標函數(shù)：objective function

58、設計后處理：post design processing(PDP)

59、交互式制圖設計：interactive drawing design

60、費用矩陣：cost metrix

61、工程圖：engineering drawing

62、方塊框圖：block diagram

63、迷宮：moze

64、組件密度：component density

65、巡回售貨員問題：traveling salesman problem

66、自由度：degrees freedom

67、入度：out going degree

68、出度：incoming degree

69、曼哈頓距離：manhatton distance

70、歐幾里德距離：euclidean distance

71、網(wǎng)絡：network

72、陣列：array

73、段：segment

74、邏輯：logic

75、邏輯設計自動化：logic design automation

76、分線：separated time

77、分層：separated layer

78、定順序：definite sequenc

五、形狀與尺寸：

1、導線（信道）：conduction(track)

2、導線（體）寬度：conductor width

3、導線距離：conductor spacing

4、導線層：conductor layer

5、導線寬度/間距：conductor line/space

6、第一導線層：conductor layer No.1

7、圓形盤：round pad

8、方形盤：square pad

9、菱形盤：diamond pad

10、長方形焊盤：oblong pad

11、子彈形盤：bullet pad

12、淚滴盤：teardrop pad

13、雪人盤：snowman pad

14、V形盤：V-shaped pad

15、環(huán)形盤：annular pad

16、非圓形盤：non-circular pad

17、隔離盤：isolation pad

18、非功能連接盤：monfunctional pad

19、偏置連接盤：offset land

20、腹（背）裸盤：back-bard land

21、盤址：anchoring spaur

22、連接盤圖形：land pattern

23、連接盤網(wǎng)格陣列：land grid array

24、孔環(huán)：annular ring

25、組件孔：component hole

26、安裝孔：mounting hole

27、支撐孔：supported hole

28、非支撐孔：unsupported hole

29、導通孔：via

30、鍍通孔：plated through hole(PTH)

31、余隙孔：access hole

32、盲孔：blind via(hole)

33、埋孔：buried via hole

34、埋/盲孔：buried/blind via

35、任意層內(nèi)部導通孔：any layer inner via hole(ALIVH)

36、全部鉆孔：all drilled hole

37、定位孔：toaling hole

38、無連接盤孔：landless hole

39、中間孔：interstitial hole

40、無連接盤導通孔：landless via hole

41、引導孔：pilot hole

42、端接全隙孔：terminal clearomee hole

43、準表面間鍍覆孔：quasi-interfacing plated-through hole

44、準尺寸孔：dimensioned hole

45、在連接盤中導通孔：via-in-pad

46、孔位：hole location

47、孔密度：hole density

48、孔圖：hole pattern

49、鉆孔圖：drill drawing

50、裝配圖：assembly drawing

51、印制板組裝圖：printed board assembly drawing

52、參考基準：datum referan

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